Silicon chip manufacturers like Intel and TSMC are constantly outdoing themselves to make ever smaller features, but they are getting closer to the physical limits of silicon. “We already have very, ...
Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...
A research team in India using a computational approach designed a perovskite solar cell combining a Dion-Jacobson (DJ) 2D layer with a 3D lead-free halide perovskite, a combination that could ...
Turn photos into 3D with Meta's SAM 3D, using SAM 2 masks and Gaussian splatting, so you can build assets quickly for ...
Over the last decade, there has been a surge in research concentrating on 2D materials other than graphene. Furthermore, by stacking different 2D materials, the attributes of 2D materials can be ...
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